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FUJITSU MICROELECTRONICS DATA SHEET
DS04-13511-3Ea
Linear IC Converter
CMOS
D/A Converter for Digital Tuning
(12-channel, 8-bit, on-chip OP amp, low-voltage)
MB88346L
DESCRIPTION
The Fujitsu Microelectronics MB88346L is a 12-channel 8-bit D/A converter capable of low-voltage operation that has amplifiers built into each of the 12 analog output lines to deliver heavy-current drive capability. The use of serial data input means that only three control lines are required, and enables cascade connection of multiple MB88346L chips. The MB88346L is suitable for applications such as electronic volume controls and replacing trimmer potentiometers in tuning systems. In addition, the MB88346L is both function-compatible and pin-compatible the currently used MB88346B, making it easy to reduce the voltage level of a system by simply replacing the MB88346B with the MB88346L.
FEATURES
* * * * * * * Low voltage operation (VCC/VDD : 2.7 V to 3.6 V) Ultra-low power consumption (0.5 mW/ch at VCC = 3 V) Ultra-compact space-saving package lineup (SSOP-20) Contains 12-channel R-2R type 8-bit D/A converter On-chip analog output amps (sink current max. 1.0 mA, source current max. 1.0 mA) Analog output range from 0 to VCC Two separate power supply/ground lines for MCU interface block/operational amplifier output buffer block and D/A converter block * Serial data input : maximum operating speed 2.5 MHz (maximum operating speed in cascade connection is 1.5 MHz) * CMOS process * Package lineup includes DIP 20-pin, SSOP 20-pin
Copyright(c)2000-2008 FUJITSU MICROELECTRONICS LIMITED All rights reserved 2006.12
MB88346L
PIN ASSIGNMENT
(Top view)
VSS AO3 AO4 AO5 AO6 AO7 AO8 AO9 AO10 VDD
1 2 3 4 5 6 7 8 9 10
20 19 18 17 16 15 14 13 12 11
GND AO2 AO1 DI CLK LD DO AO12 AO11 VCC
(DIP-20P-M02) (FPT-20P-M03)
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MB88346L
PIN DESCRIPTION
Pin No. Symbol I/O Function Serial address/data input to the internal 12-bit shift register : The address/data format is that upper 4 bits (D11 to D8) indicate an address and lower 8 bits (D7 to D0) indicate data. The D11 (MSB) is the firstin bit and D0 (LSB) is the last-in bit. Outputs MSB bit data from 12-bit shift register. Shift clock input to the internal 12-bit shift register : At the rising edge of CLK data on the DI pin is shifted into the LSB of the shift register and contents of the shift register are shifted right (to the MSB) . Load strobe input for a 12-bit address/data : A high level on the LD pin latches a 4-bit address (upper 4 bits : D11 to D8) of the internal 12-bit shift register into the internal address decoder, and writes 8-bit data (lower 8 bits : D7 to D0) of the shift register into an internal data latch selected by the latched address.
17
DI
I
14 16
DO CLK
O I
15
LD
I
18 19 2 3 4 5 6 7 8 9 12 13 11 20 10 1
AO1 AO2 AO3 AO4 AO5 AO6 AO7 AO8 AO9 AO10 AO11 AO12 VCC GND VDD VSS
O
8-bit D/A output pins with OP amps.

MCU interface and OP amp power supply pin. MCU interface and OP amp ground pin. D/A converter power supply pin. D/A converter ground pin.
3
MB88346L
BLOCK DIAGRAM
DI CLK
12-bit shift register D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11
DO
Address decoder 8 12 1234 12
LD
D0
D7
D0
D7
1
8-bit latch
12
8-bit latch
8-bit R-2R D/A converter
8-bit R-2R D/A converter
+ -
+ -
VCC
GND
AO1
AO12
VDD
VSS
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MB88346L
DATA CONFIGURATION
The MB88346L has a 12-bit shift register for controlling the chip. The data passed to the 12-bit shift register needs to be supplied in the following format. The data structure consists of a total of 12 bits, four for address selection and eight for D/A data output.
1. Shift Register Control Data Configuration
Last LSB D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10
First MSB D11
D/A data output
Address selection
2. D/A Converter Control Signals
D0 0 1 0
* * *
D1 0 0 1
* * *
D2 0 0 0
* * *
D3 0 0 0
* * *
D4 0 0 0
* * *
D5 0 0 0
* * *
D6 0 0 0
* * *
D7 0 0 0
* * *
D/A data output = VSS : = VLB + VSS : = VLB x 2 + VSS :
* * *
0
1
1
1 1
1 1
1 1
1 1
1 1
= VLB x 254 + VSS : = VDD :
1 1 1 VLB = (VDD - VSS) /255
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MB88346L
3. Address Selection Signals
D8 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 D9 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 D10 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 D11 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 Don't Care AO1 selection AO2 selection AO3 selection AO4 selection AO5 selection AO6 selection AO7 selection AO8 selection AO9 selection AO10 selection AO11 selection AO12 selection Don't Care Don't Care Don't Care Address selection
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MB88346L
OPERATING DESCRIPTION
1. Timing Chart for Data Condition Setup
MSB LSB D10 D9 D8 D2 D1 D0
DI
D11
CLK
LD
D/A data output
2. Analog Output Voltage Range
R-2R ladder output VDD OP amp output VCC VAOH (V CC)
D/A output range (linear range)
VAOL (GND) VSS GND
VCC = VDD GND = VSS
7
MB88346L
ABSOLUTE MAXIMUM RATINGS
Parameter Power supply voltage Input voltage Output voltage Power consumption Operating temperature Storage temperature * : VCC VDD WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current, temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings. Symbol VCC VDD* VIN VOUT PD Ta Tstg GND used as reference, Ta = + 25 C Condition Rating Min - 0.3 - 0.3 - 0.3 - 0.3 - 20 - 55 Max + 7.0 + 7.0 VCC + 0.3 VCC + 0.3 250 + 85 + 150 Unit V V V V mW C C
RECOMMENDED OPERATING CONDITIONS
Parameter Power supply voltage 1 Power supply voltage 2 Analog output source current Analog output sink current Oscillator limiting output capacity Digital data value range Operating temperature Symbol VCC GND VDD VSS IAL IAH CAL Ta Condition VDD - VSS 2.0 V VCC = 3.0 V VCC = 3.0 V Value Min 2.7 2.0 GND #00 - 20 Typ 0 Max 3.6 VCC VCC - 2.0 1.0 1.0 0.1 #FF + 85 Unit V V V V mA mA F C
WARNING: The recommended operating conditions are required in order to ensure the normal operation of the semiconductor device. All of the device's electrical characteristics are warranted when the device is operated within these ranges. Always use semiconductor devices within their recommended operating condition ranges. Operation outside these ranges may adversely affect reliability and could result in device failure. No warranty is made with respect to uses, operating conditions, or combinations not represented on the data sheet. Users considering application outside the listed conditions are advised to contact their representatives beforehand.
8
MB88346L
ELECTRICAL CHARACTERISTICS
1. DC Characteristics
(1) Digital Block (VDD, VCC = 2.7 V to 3.6 V (VCC VDD) , GND = VSS = 0 V, Ta = -20 C to +85 C) Symbol VCC ICC IILK VIL VIH VOL VOH DO CLK, DI, LD VCC Pin Condition Stationary (CLK signal stopped) , no load VIN = 0 to VCC IOL = 2.5 mA IOH = - 400 A Value Min 2.7 - 10 0.8 VCC VCC - 0.4 Typ 3.0 1.2 Max 3.6 3.0 + 10 0.2 VCC 0.4 Unit V mA A V V V V
Parameter Power supply voltage Power supply current 1 Input leak current L level input voltage H level input voltage L level output voltage H level output voltage (2) Analog Block 1
(VDD, VCC = 2.7 V to 3.6 V (VCC VDD) , GND = VS = 0 V, Ta = -20 C to +85 C) Parameter Power consumption Analog voltage Resolution Monotonic increase Nonlinearity error Differential linearity error Symbol IDD VDD VSS Res Rem LE DLE Pin VDD VDD VSS Condition Maximum setting value from #00 to #FF VDD - VSS 2.0 AO1 to AO12 VDD VCC - 0.1 V, VSS 0.1 V, no load Value Min 2.0 GND - 1.5 - 1.0 Typ 0.6 8 8 Max 1.5 VCC VCC - 2.0 + 1.5 + 1.0 Unit mA V V bit bit LSB LSB
Nonlinearity error : Deviation (error) in input/output curves with respect to an ideal straight line connecting output voltage at "00" and output voltage at "FF." Differential linearity error : Deviation (error) in amplification with respect to theoretical increase in amplification per 1-bit increase in digital value.
Ideal straight line Analog output VAOH
Non linearity error VAOL Digital setting #00 #FF
Note : The value of VAOH and VDD, and the value of VAOL and VSS are not necessarily equivalent.
9
MB88346L
(3) Analog Block 2
(VDD, VCC = 2.7 V to 3.6 V (VCC VDD) , GND = VSS = 0 V, Ta = -20 C to +85 C) Symbol Pin Condition VDD = VCC = 3.0 V, VSS = GND = 0.0 V, IAL = 0 A Digital data = #00 VDD = VCC = 3.0 V, VSS = GND = 0.0 V, IAL = 500 A Digital data = #00 VDD = VCC = 3.0 V, VSS = GND = 0.0 V, IAH = 500 A Digital data = #00 VDD = VCC = 3.0 V, VSS = GND = 0.0 V, IAL = 1.0 mA Digital data = #00 VDD = VCC = 3.0 V, VSS = GND = 0.0 V, IAH = 1.0 mA Digital data = #00 VDD = VCC = 3.0 V, VSS = GND = 0.0 V, IAL = 0 A Digital data = #FF VDD = VCC = 3.0 V, VSS = GND = 0.0 V, IAL = 500 A Digital data = #FF VDD = VCC = 3.0 V, VSS = GND = 0.0 V, IAH = 500 A Digital data = #FF VDD = VCC = 3.0 V, VSS = GND = 0.0 V, IAL = 1.0 mA Digital data = #FF VDD = VCC = 3.0 V, VSS = GND = 0.0 V, IAH = 1.0 mA Digital data = #FF Value Min Typ Max VSS + 0.1 Unit
Parameter
Output minimum voltage 1
VAOL1
VSS
V
Output minimum voltage 2
VAOL2
VSS - 0.2
VSS
VSS + 0.2
V
Output minimum voltage 3
VAOL3
VSS
VSS + 0.2
V
Output minimum voltage 4
VAOL4
VSS - 0.3
VSS
VSS + 0.3
V
Output minimum voltage 5
VAOL5 AO1 to AO12
VSS
VSS + 0.3
V
Output maximum voltage 1
VAOH1
VDD - 0.1
VDD
V
Output maximum voltage 2
VAOH2
VDD - 0.2
VDD
V
Output maximum voltage 3
VAOH3
VDD - 0.2
VDD
VDD + 0.2
V
Output maximum voltage 4
VAOH4
VDD - 0.3
VDD
V
Output maximum voltage 5
VAOH5
VDD - 0.3
VDD
VDD + 0.3
V
10
MB88346L
2. AC Characteristics
(VDD, VCC = 2.7 V to 3.6 V (VCC VDD) , GND = VSS = 0 V, Ta = - 20 C to +85 C) Parameter Clock L level pulse width Clock H level pulse width Clock rise time Clock fall time Data setup time Data hold time Load setup time Load hold time Load H level pulse width Data output delay time D/A output settling time Symbol tCKL tCKH tCr tCf tDCH tCHD tCHL tLDC tLDH tDO tLDD Condition Refer to "* Load condition 1" Refer to "* Load condition 2" Value Min 200 200 30 60 200 100 100 70 Max 200 600 300 Unit ns ns ns ns ns ns ns ns ns s
* Load condition 1 Measurement point CL = 20 pF to 100 pF
* Load condition 2 Measurement point R AL = 10 k
CAL = 50 pF
11
MB88346L
* Input/output timing
tCr tCKH tCf
CLK
tCKL
DI
tLDH tDCH tCHD tCHL
tLDC
LD
tLDD
D/A output
tDO
90 % 10 %
DO
Note: Decision levels: 80 % and 20 % of VCC
VAO vs. IAO CHARACTERISTICS : EXAMPLE
Ta = +25C 3.0 V MB88346L VDD DI CLK LD VSS VCC AO1 to AO12 GND 3.0 V Source current Sink current
Pattern input
V
(Continued)
12
MB88346L
(Continued)
[mV] 3,000 2,980 2,960 Analog output level 2,940 2,920 2,900 2,880 2,860 2,840 2,820 2,800 1.0 0.8 0.6 0.4 0.2 0.0 0.2 0.4 0.6 0.8 1.0 [mA] #FF setting
Sink current
Source current
[mV] 1,600 1,580 1,560 Analog output level 1,540 1,520 1,500 1,480 1,460 1,440 1,420 1,400 1.0
#80 setting
0.8 0.6 0.4 Sink current
0.2
0.0
0.2
0.4 0.6 0.8 Source current
1.0
[mA]
[mV] 200 180 160 Analog output level 140 120 100 80 60 40 20 0 1.0
#00 setting
0.8 0.6 0.4 Sink current
0.2
0.0
0.2
0.4 0.6 0.8 Source current
1.0
[mA]
13
MB88346L
ORDERING INFORMATION
Part number MB88346LP MB88346LPFV Package 20-pin plastic DIP (DIP-20P-M02) 20-pin plastic SSOP (FPT-20P-M03) Remarks
14
MB88346L
PACKAGE DIMENSIONS
20-pin plastic DIP Lead pitch Row spacing Sealing method 2.54mm(100mil) 7.62mm(300mil) Plastic mold
(DIP-20P-M02)
20-pin plastic DIP (DIP-20P-M02)
24.64 -0.30 .970 -.012
+.008 +0.20
INDEX-1 INDEX-2 6.200.25 (.244.010)
4.36(.172)MAX
0.51(.020)MIN 0.250.05 (.010.002)
3.00(.118)MIN
0.460.08 (.018.003) 15MAX
0.86 -0 1.27(.050) MAX
+0.30 +.012
1.27 -0 .050 -0
+0.30
.034 -0
+.012
7.62(.300) TYP
2.54(.100) TYP
C
1994 FUJITSU LIMITED D20003S-3C-4
Dimensions in mm (inches). Note: The values in parentheses are reference values.
Please confirm the latest Package dimension by following URL. http://edevice.fujitsu.com/package/en-search/ (Continued)
15
MB88346L
(Continued)
20-pin plastic SSOP Lead pitch Package width x package length Lead shape Sealing method Mounting height Weight 0.65 mm 4.40 x 6.50 mm Gullwing Plastic mold 1.45 mmMAX 0.09g P-SSOP20-4.4x6.5-0.65
(FPT-20P-M03)
Code (Reference)
20-pin plastic SSOP (FPT-20P-M03)
*1 6.500.10(.256.004)
20 11
Note 1) *1 : Resin protrusion. (Each side : +0.15 (.006) Max). Note 2) *2 : These dimensions do not include resin protrusion. Note 3) Pins width and pins thickness include plating thickness. Note 4) Pins width do not include tie bar cutting remainder.
0.170.03 (.007.001)
INDEX
*24.400.10 6.400.20 (.173.004) (.252.008)
Details of "A" part 1.25 -0.10 .049 -.004 LEAD No.
1 10
+0.20 +.008
(Mounting height)
0.65(.026)
"A" 0.240.08 (.009.003) 0.13(.005)
M
0~8 0.100.10 (Stand off) (.004.004) 0.25(.010)
0.10(.004)
0.500.20 (.020.008) 0.600.15 (.024.006)
C
2003 FUJITSU LIMITED F20012S-c-4-6
Dimensions in mm (inches). Note: The values in parentheses are reference values.
Please confirm the latest Package dimension by following URL. http://edevice.fujitsu.com/package/en-search/
16
MB88346L
MEMO
17
MB88346L
MEMO
18
MB88346L
MEMO
19
FUJITSU MICROELECTRONICS LIMITED
Shinjuku Dai-Ichi Seimei Bldg. 7-1, Nishishinjuku 2-chome, Shinjuku-ku, Tokyo 163-0722, Japan Tel: +81-3-5322-3347 Fax: +81-3-5322-3387 http://jp.fujitsu.com/fml/en/ For further information please contact: North and South America FUJITSU MICROELECTRONICS AMERICA, INC. 1250 E. Arques Avenue, M/S 333 Sunnyvale, CA 94085-5401, U.S.A. Tel: +1-408-737-5600 Fax: +1-408-737-5999 http://www.fma.fujitsu.com/ Europe FUJITSU MICROELECTRONICS EUROPE GmbH Pittlerstrasse 47, 63225 Langen, Germany Tel: +49-6103-690-0 Fax: +49-6103-690-122 http://emea.fujitsu.com/microelectronics/ Korea FUJITSU MICROELECTRONICS KOREA LTD. 206 KOSMO TOWER, 1002 Daechi-Dong, Kangnam-Gu,Seoul 135-280 Korea Tel: +82-2-3484-7100 Fax: +82-2-3484-7111 http://www.fmk.fujitsu.com/ Asia Pacific FUJITSU MICROELECTRONICS ASIA PTE LTD. 151 Lorong Chuan, #05-08 New Tech Park, Singapore 556741 Tel: +65-6281-0770 Fax: +65-6281-0220 http://www.fujitsu.com/sg/services/micro/semiconductor/ FUJITSU MICROELECTRONICS SHANGHAI CO., LTD. Rm.3102, Bund Center, No.222 Yan An Road(E), Shanghai 200002, China Tel: +86-21-6335-1560 Fax: +86-21-6335-1605 http://cn.fujitsu.com/fmc/ FUJITSU MICROELECTRONICS PACIFIC ASIA LTD. 10/F., World Commerce Centre, 11 Canton Road Tsimshatsui, Kowloon Hong Kong Tel: +852-2377-0226 Fax: +852-2376-3269 http://cn.fujitsu.com/fmc/tw
All Rights Reserved. The contents of this document are subject to change without notice. Customers are advised to consult with sales representatives before ordering. The information, such as descriptions of function and application circuit examples, in this document are presented solely for the purpose of reference to show examples of operations and uses of FUJITSU MICROELECTRONICS device; FUJITSU MICROELECTRONICS does not warrant proper operation of the device with respect to use based on such information. When you develop equipment incorporating the device based on such information, you must assume any responsibility arising out of such use of the information. FUJITSU MICROELECTRONICS assumes no liability for any damages whatsoever arising out of the use of the information. Any information in this document, including descriptions of function and schematic diagrams, shall not be construed as license of the use or exercise of any intellectual property right, such as patent right or copyright, or any other right of FUJITSU MICROELECTRONICS or any third party or does FUJITSU MICROELECTRONICS warrant non-infringement of any third-party's intellectual property right or other right by using such information. FUJITSU MICROELECTRONICS assumes no liability for any infringement of the intellectual property rights or other rights of third parties which would result from the use of information contained herein. The products described in this document are designed, developed and manufactured as contemplated for general use, including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as contemplated (1) for use accompanying fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for use requiring extremely high reliability (i.e., submersible repeater and artificial satellite). Please note that FUJITSU MICROELECTRONICS will not be liable against you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. Exportation/release of any products described in this document may require necessary procedures in accordance with the regulations of the Foreign Exchange and Foreign Trade Control Law of Japan and/or US export control laws. The company names and brand names herein are the trademarks or registered trademarks of their respective owners.
Edited Strategic Business Development Dept.

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